#外资研报

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MS-欧洲半导体行业:Soitec与Besi的共封装光学(CPO)机遇 Technology - European Semiconductors Europe Framing the CPO opportunity for Soitec and Besi.pdf

MS-四月数据分歧-销售复苏谨慎-20260521.pdf

MS-味之素(Ajinomoto, 2802.T)小范围会议要点 Ajinomoto (2802) Japan Small Meeting Key Takeaways.pdf

MS-闻泰科技(600745.SS):安世半导体纠纷是关键变量;下调评级至减持 Wingtech Technology Co Ltd Asia Pacific Nexperia Dispute a Key Variable; Downgrade to UW.pdf

MS-亚洲宏观故事全靠半导体吗-20260521.pdf

MS-伊朗乐观推动风险资产反弹-20260521.pdf

MS-大中华科技硬件亚太地区 Rubin 服务器机架物料清单、组件含量及 ODM 附加价值分析 Greater China Technology Hardware Asia Pacific Analysis of Rubin rack BOM, component content, and ODM value-added.pdf

MS-大中华区科技硬件:自动化——日本机床工业协会2026年4月初步订单的行业映射 Greater China Technology Hardware Asia Pacific Automation – Read-across from Preliminary JMTBA April 2026 Orders.pdf

MS-电子元器件——重新聚焦北美智能手机高附加值元器件及 AI 计算 Investor Presentation Japan Electronic Components Renewed Focus on Value-Added N. American Smartphone Components Plus AI Computing.pdf